Le groupe NIEF PLASTIC transforme LES THERMOPLASTIQUES par injection et LES THERMODURCISSABLES par injection et compression
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R & D

Materials and processes

3D-MID

3D MID

The 3D-MID allows the simultaneous integration of electronical and mechanical or thermal functions with a 3D architecture on a part at moulding stage. Therefore this goes beyond a simple electronical circuit, even in 3D.

Various processes of production can be considered according to :
* the dimensions of the part : from some millimeters up to several centimeters
* the number of parts to be manufactured : from some dozens up to several millions
* the need to be adapted to the customer's request (customisation)
* the voltage and density of electrical current
* the quantity and type of electronical components
* the specifications of the parts

Nief Plastic has a know-how in the following production processes :
* laser activation
* bi-material injection with selective plating
* bi-injection of intrinsically conductive raw materials









Importance of the choice for MID process at design stage

















Comparison of MID processes